Every part.
Verified.
Free.
Symbols, footprints, and 3D models for every part — exportable in .kicad_sym, .kicad_mod, and .step. IPC-7351B compliant. No login. No paywall.
The standard distributor catalogs lock ECAD modules behind enterprise contracts. This one doesn't. The full library, the full API, and the part-creation pipeline are open and addressable.
Every record, exportable. Every search, addressable.
—
Footprints
—
Symbols
—
Components
—
Total records
live · pulled from GET /api/v1/stats · seeded against IPC-7351B, growing.
ECAD modules are paywalled.
The dominant distributor parts API tier-gates ECAD modules — symbols, footprints, 3D models — into its enterprise contract. Its free tier returns 100 matched parts and zero ECAD geometry. Its mid tier returns datasheets and specs but still nothing you can drop into a board.
The free alternatives — SnapEDA, UltraLibrarian, Component Search Engine — all require a login, and most ship one symbol-and-footprint format per part with no programmatic addressability.
The premise here is simple: the geometry that a part has is not a commercial asset. It belongs to whoever needs to put the part on a board.
Catalog · distributor · datasheet.
Open catalogs
JLCPCB parts library, LCSC, KiCad official + community footprint repos, Espressif/Adafruit/SparkFun. Scraped, normalized, addressable by MPN.
POST /api/v1/scrape/trigger
Live cross-reference
Distributor APIs (Digi-Key, Mouser, Nexar evaluation tier) cross-reference MPN → datasheet → live stock + lifecycle. Never the source of truth — the verifier.
GET /api/v1/parts/search?q=…
PDF → part record
Drop a datasheet PDF. A specialized extraction pipeline reads pinout, electrical specs, and package dimensions, generates an IPC-7351B footprint, and asks you to verify before save.
POST /api/v1/ingest (soon)
One-click is a lie.
A vision LLM on a raw datasheet PDF gets the package geometry wrong roughly 9 times in 10. A specialized extractor reaches ~72% — useful, but not done. Every extracted record enters the library as a draft that a human verifies before it becomes a download.
Source: arXiv:2508.03725 · general vision LLMs fail on geometric perception, technical annotations, and dense diagram complexity.
IPC-7351B land patterns, computed.
Every generated footprint runs through the IPC-7351B land pattern calculation — lead dimensions, lead tolerances, fabrication tolerance, placement tolerance, density level. Three density variants per package: Most, Nominal, Least.
Generated catalog covers SOIC, QFP, QFN, BGA, DIP, SOT, chip, crystal, and diode packages. Request a density and a package family, get a fab-ready footprint.
GET /api/v1/generate/catalog?density=nominalMaximum solder-joint reliability
Hand assembly · low-vibration board · prototype.
Default for most boards
Standard SMT production · balanced.
Maximum board density
Fine-pitch · tight pad reduction · advanced fab.
The whole library, by HTTP.
One part record. Every surface.
openie-cad
The unified mechanical + electrical + simulation engine. Place footprints from this library directly onto a board.
napkin sketcher
Sketch a schematic, drop in parts from this library, hand it off to openie-cad for layout and simulation.
the rest
The full periodic stack family — compute, data, state, communication, memory, knowledge, agent, proof, synthesis.
Start with one part.
Search the library, copy the API call, or upload a datasheet.